L i b r a r y & I n f o r m a t i o n R e s o u r c e s
Materials for high-density electronic packaging and interconnection: report of the committee on materials for high-density electronic packaging
| Corporate | ,National Materials Advisory Board, Washington ; | Publication Data | [s.l]: National Academy Press, 1990 | Physical Description | XIV, 139p | Subject Area | Engineering | Subject Headings | electronic packaging | Call Number | 621.381046 NAT |
Item Information
| Copy | Barcode | Reg # | Volume ID | Item Status | Due Date | Location | Media Type | 1 | E001003 | AVAILABLE | English hall - 1st floor |
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